Join TempAid at the Asembia AXS23 Summit from April 29th to May 2nd in Las Vegas

The Asembia AXS23 Summit annual conference and trade show (April 29th to May 2nd, Las Vegas) will bring together industry professionals for a unique opportunity to network, attend informative sessions, view exhibits, and more.

We would love to meet with you if you plan to attend this year’s event. Join us at the TempAid booth #2324 in the south section of the exhibitor hall to discover a wide range of products and solutions specifically designed to help you maintain the temperature integrity of your products.

The event will feature our revolutionary PCM Envelope Mailer. The new validated solution integrates PCM refrigerants to provide stable temperatures and protection from temperature excursions. The solution minimizes components and storage space and reduces shipping and component costs by up to 40%.

Our team of experts will also be on hand to answer any of your questions and provide personalized consultations. If you’d like to schedule a meeting in advance to make the most of your visit, request an appointment here.